IAA 2022
International Conference on Industrial Applications of Adhesives with Abreu Events Organization
It is intended that this conference will be held every two years. The conference is chaired by Lucas F. M. da Silva and co-chaired by R. D. Adams (University of Oxford, UK), Chiaki Sato (Tokyo Institute of Technology) and Prof Klaus Dilger (Technische Universität Braunschweig, Germany).
The focus will be on applications of adhesive bonding in the industry such as automotive, aeronautic, railway, marine, energy, electronics, etc. The idea is to bring together the adhesive makers and the adhesive users to exchange experiences and facilitate potential synergies and partnerships.
As organizer of the event, Abreu Events is responsible for services such as Registration Mangement, Accommodation for Participants , Space Rental, Catering and Conference Dinner.
Learn more about the IAA 2022 conference at: https://web.fe.up.pt/~iaa2022/
